Used MITSUNAGA MFL-4B-5S #9223148 for sale

MITSUNAGA MFL-4B-5S is a precision wafer grinding, lapping and polishing machine, specifically designed for ultra-thin wafer processing and handling. It is based on an advanced single wafer platform combined with optimal motion control capabilities and is designed to enable high productivity and cost-effectiveness in processing. In terms of construction, MFL-4B-5S features a dual-rotary lap equipment, a main rotating lapping plate, a grindstone for grinding wafer edges, and a single precision polishing wheel for superior surface finish. It also includes an integrated wafer handling system for safe, efficient and precise wafer transfer between different process stages. The unit also offers automatic edge detection, surface inspection and wafer orientation. In terms of its operation, MITSUNAGA MFL-4B-5S has a high-speed auto-synchronizing main drive which ensures precision spindle speed and motion control within the set parameters. It is designed with an advanced process control machine and a touch screen interface which enable quick and easy programming of various process parameters such as rotation and force, and hence, allows the tool to be used in a variety of application scenarios. The asset also features a high-speed air bearing spindle which enables precise polishing. MFL-4B-5S is known for its very low thermal drift and vibration performance, thus ensuring that the model performance remains consistent and reliable in high-temperature and other harsh operating conditions. Additionally, the equipment also ensures the production of high-quality end products with superior surface finish and precision. In conclusion, MITSUNAGA MFL-4B-5S is an excellent wafer grinding, lapping and polishing system, which offers excellent control and accuracy. It is designed to help achieve high productivity and performance with respect to cost-effectiveness, thus making it an ideal choice for those looking for precision wafer processing and handling.