Used MITSUNAGA MFL-9B #9143464 for sale

MITSUNAGA MFL-9B is a versatile wafer grinding, lapping, and polishing equipment designed to produce high precision and ultra-smooth surfaces. The system allows users to achieve high finish, reduced micron size, and minimize edge roughness with results that are considered much higher than traditional processes. As a part of its robust construction, MFL-9B features industrial strength components, heavy-duty mounts, and a rigid and precise frame. The unit mainly consists of two parts: the grinding and lapping components consisting of a grinding stage and two lapping stages, and the polishing components made up of the polishing wheel, pads, and diamond solution. The grinding stage of MITSUNAGA MFL-9B is made up of a precision-ground hardwearing stand and a low-cost ceramic-based abrasive. This grinding machine has a wide range of grindability to accommodate most kinds of surfaces and can also be used to action step work, high-precision corner grinding, and angle grinding. On the other hand, the two lapping stages are used to successively polish the surface to really smooth it before moving on to the next step. The polishing component is designed to provide superior finish and smoothness that meets industry standards. This consists of Diamond Wheel, a standard diamond solution, and two special polishing pads. The Diamond Wheel is made up of diamond grains embedded with diamond particles that provide optimal surface finish and highest accuracy. The diamond solution is then used to cool the wheel during the operation. Finally, the two special polishing pads will be used to polish and refine the wafer surface until it achieves an ultra-smooth, high quality mirror finish. MFL-9B also offers exceptional user-friendliness and flexibility to accommodate for various wafer sizes and materials. This tool can also be used with a variety of other standard or custom grinders, lapping machines, and polishers. In addition, specific configurations of the asset are available to optimize the grinding, lapping, and polishing process and get the best results for the specific application. MITSUNAGA MFL-9B is perfect for any industry that needs to produce high precision surfaces and ultra-smooth surfaces. Its capability to deliver top quality results with reduced micron size and minimized edge roughness make it an ideal choice for wafer grinding, lapping, and polishing.