Used MITSUNAGA MFLN-4B #9086153 for sale

MITSUNAGA MFLN-4B is a wafer grinding, lapping & polishing equipment designed to grind, lap, and polish the surfaces of single or multiple semiconductor wafers. This system is capable of achieving extremely stringent surface finish quality specifications. MFLN-4B unit consists of multiple components, including a grind tray, a four-axis gimbal table, a polishing chamber, a vacuum pump, and a power supply. The grind tray is designed to hold a wafer in place during grinding operations. The four-axis gimbal table is used to hold the wafer and adjust the orientation of the wafer, as required. The polishing chamber is used to polish the wafer and reduce surface roughness. The vacuum pump provides vacuum to the grinding and lapping process, as well as maintaining a clean environment that prevents contamination of the wafer surface. The power supply provides power to the grind tray, four-axis gimbal table, and polishing chamber. The main components of MITSUNAGA MFLN-4B machine are designed to produce highly accurate, consistent surface finishes. The grind tray is designed to provide a stable platform for grinding operations, while the four-axis gimbal table allows for precise orientation of the wafer. The polishing chamber is designed to polish the wafer to a smooth finish. The vacuum pump and power supply help to ensure consistent results by controlling temperature and providing uniform power supply. MFLN-4B tool is designed for ease of use and safety. The asset is protected from overcurrent and short-circuit conditions, and the power supplies are designed to reduce electrical arcing and sparking. An automatic shutoff feature is included to shut off power in the event of an overload or overcurrent. The model also has built-in safety interlocks to prevent dangerous situations. MITSUNAGA MFLN-4B wafer grinding, lapping and polishing equipment is a versatile, accurate, and reliable system designed to achieve very precise and repeatable surface finish quality. The unit is simple to operate and provides consistent production quality at production rates. With these features, MFLN-4B provides an effective solution for wafer grinding and polishing operations.