Used MITSUNAGA MFLN-6B #293616747 for sale

MITSUNAGA MFLN-6B is an automated wafer grinding, lapping, and polishing machine specifically designed for semiconductor fabrication. It is a fully automated, CNC-controlled grinding equipment capable of high-precision, superior performance, repeatability, and automated maintenance. MFLN-6B features a large, heavy-duty abrasive grinding wheel that is driven by a high-powered spindle motor. The grinding wheel is mounted in a precision holder and rotates at up to 1,000 RPM. The spindle motor is controlled by an onboard computer that allows for a variety of grinding and polishing cycles to be programmed and automated. The system also includes a lapping plate located below the grinding wheel. The lapping plate is adjustable allowing for precise measurements and adjustments depending on the application. This allows for exact grinding parameters to be set and maintained. Additionally, the lapping plate offers a degree of automation to the process, allowing for consistent lapping of the sample wafer. MITSUNAGA MFLN-6B also offers a variety of polishing pads and abrasives, allowing the operator to use the best unit for the job being done. This ensures that the wafers are consistently polished and protected, and that any undesired residual material is removed. Finally, the machine has a 6-axial turntable, allowing for flexible orientation of the samples and greater process flexibility. This is ideal for achieving the most precise grinding and polishing results, as the turntable allows for time-sensitive steps and manual tuning of the process. In conclusion, MFLN-6B is an advanced, automated wafer grinding, lapping, and polishing machine. It offers the most precise, repeatable, and consistent grinding results possible, allowing for reliable production of high quality semiconductor samples.