Used MITSUNAGA MFLN-6B2MT #9086151 for sale

MITSUNAGA MFLN-6B2MT is a state-of-the-art wafer grinding, lapping and polishing equipment designed to provide high efficiency and precision results in a wide range of applications. The system is equipped with six independent grinding positions equipped for either double or single side processing, allowing for maximum versatility and flexibility. It also boasts a number of automated features, such as multiple grinding speeds, automatic start and stop, and integration of external temperature and humidity controls for optimal performance. The unit has a modular design and an automated grinding wheel changing machine, making it easy to maintain and repair. MFLN-6B2MT is equipped with a powerful, high speed grinding wheel motor, providing up to 6,500 RPM for high speed grinding and lapping operations. The adjustable grinding head provides precise control over the flatness and roughness of the surface being processed. It is also outfitted with a vacuum tool with adjustable speed, allowing for quick and efficient cleaning of the grinding wheel. Additionally, MITSUNAGA MFLN-6B2MT features an automatic abrasive selection asset that allows for the simple switching between different abrasives and grinding wheel designs for different applications. Moreover, MFLN-6B2MT provides high precision grinding and polishing results with its high quality, precision manufactured components. Its advanced wafer loader allows for secure handling of fragile wafers during transport and loading, and its optical thickness gauge ensures that the wafers are machined to the specified thickness parameters. Additionally, the model's mechanical design guarantees a low profile and minimal disturbance to the surrounding environment, significantly improving the overall processing performance. Overall, MITSUNAGA MFLN-6B2MT is an advanced wafer grinding, lapping and polishing equipment, suitable for a wide range of applications. Its powerful motor, advanced abrasive selection system, precision machined components and secure wafer handling capabilities provide precise, efficient and reliable results. The unit's automated features and low profile mechanical design enable MFLN-6B2MT to reduce the time and cost associated with wafer processing, making it a great choice for industrial and research applications.