Used MITSUNAGA MFLN-6B4MT #293616749 for sale

MITSUNAGA MFLN-6B4MT is a fully automated wafer grinding, lapping, and polishing equipment designed to produce superior quality semiconductor wafers. This all-in-one system delivers high-precision, high production throughput and excellent surface finish for a broad range of wafer substrates. MFLN-6B4MT is equipped with an intelligent grinding unit which uses special rotary brush technology to effectively remove surface defects, while maintaining the correct surface profile while simultaneously abrading and polishing the wafer. This machine eliminates the need for additional equipment, saving both time and cost. MITSUNAGA MFLN-6B4MT is a small air-cooled machine, allowing it to be placed in tight spaces and has a quick start-up time, allowing it to be ready to use at a moment's notice. The tool is noise and dust-free, and designed to run with minimal operator supervision. It has a high-performance lapping plate with a 6-inch wafer capacity and the option of utilizing either an oil lubricant or a non-oil lubricant for the lapping process. Additionally, the asset is equipped with special classifiers that separate the final product from the media used for abrasion and polishing. The 6B4MT also includes a slurry tank for aqueous or nonaqueous slurrying, a chiller unit to reduce the piston pressure and prevent damage to the finished workpieces, and a powerful twin-head automatic polisher (including two polishing heads) designed to obtain the desired surface finish and profile. Additionally, the model contains a fully automated data logging equipment, which provides comprehensive output information on the wafer-processing results, and a computer-controlled user interface with an intuitive touchpad or LED display to ensure consistent operation. MFLN-6B4MT is a reliable, cost-effective and user-friendly system for producing high-quality precision semiconductor wafers. It is equipped with a series of safety features to prevent overloading, and its advanced, energy-efficient design ensures optimal performance in all types of production environments. The unit is also capable of accurately reproducing a wide range of wafer characteristics, enabling production of high-yield, highly efficient and cost-effective wafers with minimal waste and operator intervention.