Used MITSUNAGA MFLN-9B #293616750 for sale

MITSUNAGA MFLN-9B is a wafer grinding, lapping, and polishing equipment, typically used for semiconductor processing. The system includes two main components - the mainframe unit and the grinding/lapping/polishing head unit. The mainframe unit provides a strong, stable base for the wafer grinding, lapping, and polishing process. The mainframe is designed to be vibration-resistant and can reduce the effects of environmental disturbances. The mainframe is capable of accommodating standard 200 mm and 300 mm diameter wafer cassettes. The grinding/lapping/polishing head unit is designed to perform the actual wafer grinding, lapping, and polishing process. The unit houses three grinding/polishing motorized units, each of which can grind, lap, or polish wafers, depending on the user-selected settings. The unit includes a dust suction unit and a vacuum machine for removing excess particles from the work area before and after the grinding/polishing process and for removing dust particles from the trays when transferring wafers from the mainframe to the grinding/lapping/polishing head. The tool also includes a precision linear stage, which can be positioned to precisely move the grinding/lapping/polishing grinding/polishing units to the exact point of joining for smoothing out irregularities in the wafer surface and for removing imperfections such as scratch marks. In addition, the linear stage can be used to precisely move the wafers to the right location on the grinding/polishing unit. This ensures that the grinding/lapping/polishing process is performed accurately and consistently. The asset can be operated in manual or automatic modes. In manual mode, the user is required to operate the machine manually to carry out the grinding/polishing operations. In automatic mode, the settings can be programmed according to the requirements of the job and the model will automatically control the process. MFLN-9B is designed to be compatible with a variety of wafer process parameters such as grinding speed, duration, polishing pressure and polish plate pressure. This allows users to tailor the process parameters to suit their specific applications. MITSUNAGA MFLN-9B is a highly efficient equipment for wafer grinding, lapping, and polishing. It is capable of achieving high accuracy, repeatability, and throughput. In addition, the system is easy to operate and is cost-effective.