Used MITSUNAGA NH-4B #9257647 for sale

MITSUNAGA NH-4B is a highly advanced wafer grinding, lapping and polishing equipment that is specifically designed for the fabrication of compound semiconductor substrates and other thin wafer applications. This system was specifically designed for process scalability and precise control over product characteristics. It offers a fully automated design with integrated process control capabilities, a customizable PLC interface, and advanced diagnostics capabilities. NH-4B consists of three distinct layers of grinding, lapping, and polishing, all of which can be controlled independently. The unit uses a circular motion, which ensures that optimal contact is achieved between the sample and the grinding heads. This ensures a maximum material removal rate and uniform sample preparation. The machine utilizes a high-efficiency grinding head that is designed for efficient particle removal and reduced erosion. The lapping and polishing procedures are integrated into the tool. The lapping process uses a linear stroking motion to achieve uniform polishing over the sample's entire surface. The polishing process uses progressive grade abrasives, which vary in size and shape depending on the specific application. This helps to ensure a uniform finish and smooth surface. The asset boasts an optimized operating speed for each process, ensuring that the most ideal surface finish is achieved. It also offers both single wafer and multiple wafer processing capability, depending on customer requirements. Additionally, the model can be customized to meet even the most stringent process requirements. The equipment's diagnostics agencys feature integrated fault monitoring alarms that allow the operator to analyze any malfunctions that may be occurring during the process. This feature can be used to support preventive maintenance. All of these features combine to offer unparalleled quality and performance in the fabrication of compound semiconductors and thin wafer applications. MITSUNAGA NH-4B system is designed to deliver the highest quality results in wafer grinding, lapping, and polishing for the fabrication of compound semiconductors and other thin wafer applications. It features a customizable PLC interface and advanced diagnostics capabilities, as well as an optimized operating speed for each process. It is capable of both single wafer and multiple wafer processing, and it can be customized to meet the needs of even the most demanding customers. This unit is an ideal solution for anyone looking for superior performance and reliable results in the fabrication of thin wafers.