Used MITSUNAGA NH-6B #9257648 for sale

MITSUNAGA NH-6B is a fully automated wafer grinding, lapping and polishing machine for semiconductor substrates. The equipment is designed to process silicon wAfers up to 6" in diameter. It utilizes a three-stage spindle drive mechanism to provide high precision grinding and lapping with consistent results. The first stage is the grinding spindle that spins at up to 2000 revolutions per minute and utilizes diamond abrasive discs to grind and profile the wafer surface. The second stage is the lapping spindle which moves at slower speeds of up to 700rpm and uses either diamond or SiC abrasives to achieve a very fine finish. The third stage is a polishing spindle which operates at up to 1000rpm and uses natural or synthetic diamond pastes to produce an extremely smooth surface. NH-6B system also incorporates several features to ensure consistent results across different runs. These include a high-precision linear axis unit which allows the grinding, lapping and polishing spindles to be aligned with the wafer axis for high accuracy results. The machine also uses an advanced PID (proportional-integral-derivative) feedback loop to control and adjust the speed of the grinding, lapping and polishing spindles to ensure constant torque and precise cutting conditions. In addition, the tool has a built-in cleaning station to ensure that the substrates are free of contamination before and after processing. MITSUNAGA NH-6B is a highly accurate and reliable asset that is widely accepted in the semiconductor industry for wafer grinding, lapping and polishing. It has become the model of choice in many production lines because of its high precision, consistent results, and automated features. The equipment has a large capacity and is capable of processing multiple wafers simultaneously, making it ideal for high-volume production requirements.