Used MITSUNAGA NH-9B2MT #9257652 for sale

MITSUNAGA NH-9B2MT is a powerful and user-friendly wafer grinding, lapping and polishing equipment. It is designed for grinding, lapping and polishing a variety of different wafer materials and configurations. The system features multilevel programming, allowing users to easily create, store and recall up to 10 grinding profiles. The unit comprises of an NH-9B2MT lapping/polishing machine coupled with a multiple grinding station. The grinding station consists of an X/Y/Z axis which is driven by brushless direct current motors. The motors are robust and offer precise positioning to ensure that grinding parameters are always accurately met. An air bearing spindle is used to apply the desired grinding force on the wafer. The machine has been designed for use in semiconductor fabrication processes. The grinding station allows the user to select the desired grinding parameters such as pressure, speed and number of passes. MITSUNAGA NH-9B2MT incorporates an automatic feed control tool which ensures that the grinding parameters remain within the set range throughout the entire grinding process. The lapping and polishing stations are integrated with the X/Y/Z axis and feature an adjustable bellows asset which allows for multiple levels of lapping and polishing. The bellows model can be adjusted to accommodate a variety of different wafer sizes, shapes and configurations. The grinding and lapping processes are fully automated with a display showing the ongoing process. NH-9B2MT also features automated cleaning cycles which help to maintain a clean working environment. A fluid dispenser allows for automatic discharge of flushing fluids, while a water jet cleaner removes debris from the grinding/lapping/polishing process. Overall, MITSUNAGA NH-9B2MT is a powerful and user-friendly wafer grinding, lapping and polishing equipment that offers precise and reliable results. Its precise X/Y/Z axis, adjustable bellows system and automated cleaning cycles ensure that the desired grinding parameters are met and that the unit is kept clean and free from debris. As a result, NH-9B2MT provides reliable and steady performance for both small and large wafers.