Used MITUNAGA MFL-5B #9276668 for sale

MITUNAGA MFL-5B is a wafer grinding, lapping and polishing system designed for use in the semiconductor and microelectronics industries. It is capable of producing intricately shaped wafers with a high degree of precision, accuracy and repeatability. MFL-5B is mainly composed of three components: grinding, lapping, and polishing. The grinding unit utilizes an advanced abrasive material to delicately remove undesired material from the wafer and achieve the desired shape. An adjustable milling head is used to ensure a consistent level of material removal, and a precision guide ensures that all grinding operations are performed in the same location on the wafer. The lapping process involves applying a thin, uniform coating to the wafer surface. This process allows a uniform thickness across the wafer and helps reduce unevenness and surface texture variation. MITUNAGA MFL-5B is equipped with an adjustable lap pad to ensure a consistent and uniform film application across the wafer. The wafer is then exposed to a high-vacuum environment, which creates an ultra-thin layer of oxide on the surface. This oxide coating provides electrical insulation and also increases the wafer's durability. Lastly, the polishing process is used to achieve a smooth, glossy finish on the wafer's surface. During this process, a polishing slurry is applied onto the wafer. A continuous-cycle polishing wheel is then used to delicately remove any excess material and to burnish the surface. This process helps to ensure a consistent level of smoothness and gloss across the wafer. Overall, MFL-5B is a highly reliable wafer grinding, lapping and polishing system designed to help researchers and engineers achieve the highest standards of wafer production. Its combination of grinding, lapping and polishing processes helps to ensure a highly accurate and aesthetically pleasing end result.