Used MITUTOYO HM-122 #9243737 for sale

MITUTOYO HM-122 Wafer Grinding, Lapping & Polishing Equipment is a precision and cost-effective method for grinding, lapping, and polishing a variety of semiconductor materials used in the microelectronics industry. This system integrates several stages of operation into a single machine, allowing single-side or dual-side processing of wafers, along with the capability to handle large substrates up to 200 mm in diameter. It is capable of accommodating wafer sizes between 25 mm and 200 mm, with a range of pressure settings allowing general or deep grinding. The unit utilizes advanced motion control technology to ensure grinding and polishing accuracy with a 5 μm-positioning resolution and a sub-micron-level surface grinding accuracy, in addition to an automated wafer-to-wafer alignment mechanism. It also features a dual-stage integrated spindle machine that enables simultaneous lapping and polishing operations or single-stage grinding. This tool also has a multi-functional LCD monitor for setting parameters and an optional data interface for additional diagnostics and monitoring capabilities. The innovative HM-122 asset is equipped with a high-precision base along with three adjustable axes to ensure an even and uniform contact surface between the material and the grinding plate. Its integrated aluminum alloy air knife provides a coolant or grinding aid to prevent part sticking and residual stress. Further, the model utilizes ceramic grinding plates for a longer lifespan and efficient grinding process. The optimized material design also ensures precise grinding and polishing results with minimal wear and tear. MITUTOYO HM-122 Wafer Grinding, Lapping and Polishing Equipment is an ideal choice for applications requiring high-precision grinding and polishing of semiconductor materials. With advanced motion control technology, a wide range of parameter settings, and a durable design, HM-122 offers the convenience and accuracy necessary to deliver high-quality semiconductor components.