Used MITUTOYO HM-124 #9266848 for sale

MITUTOYO HM-124 is an automated grinding, lapping and polishing equipment with multi-axis motion capabilities that can accurately and consistently process all forms of semiconductor wafers using diamond grinding and lapping technologies. It is designed for high-performance lapping of thin wafers and excess materials from wafer fabrication process. This system is ideal for use in a variety of industries, ranging from semiconductor, medical, and industrial to the aerospace, automotive, and telecommunications sectors. HM-124 grinding unit has a unique design to maximize surface quality and produce a precise and uniform finish. It utilizes the latest in diamond grinding and lapping technology. The machine features precise motion control, high-speed rotation, and pneumatically actuated force feedback. This allows for consistent material removal and precise control of the grinding process. The tool is also designed for fast loading and unloading of wafers, allowing for increased productivity. In addition, MITUTOYO HM-124 asset can be customized and programmed to meet the specific needs of the user. It can be optimized for different sizes of wafers and allows for the incorporation of various accessories such as manipulators, load locks and polishing pads. In addition, it includes a central monitoring and control module that allows for efficient operation and management of all the model's components. HM-124 equipment is designed for reliable, repeatable results and offers a high level of control over wafer grinding, lapping and polishing processes. This system is capable of providing high accuracy, fast response times and extended process cycles, making it suitable for use in a variety of industrial applications. The unit is energy efficient and offers a low operating cost, making it a cost-effective solution for processing of semiconductor wafers.