Used MITUTOYO MVK-H2 #9267285 for sale

MITUTOYO MVK-H2 is a high-precision wafer grinding, lapping and polishing equipment designed for a wide range of applications in the semi-conductor and opto-electronic industries. The system is capable of accurately finishing a variety of wafer sizes, from 50.8 mm to 200 mm. It can also process up to 8 wafers at a time. MVK-H2 is capable of processing wafers at high speed with a precision of up to 0.001 micron. It has a spindle speed of up to 15,000 RPM, a maximum processing speed of 20 μm/s and a maximum material removal rate of 10 μm/min. The unit also has a programmable pressure machine and a vacuum tool. The wafers are loaded onto the asset by a robotic arm. This arm can lift and move the wafer into the positioning and chucking station. Once the wafer is positioned and secured, the robotic arm will then move the wafer into the lapping disc. The lapping disc is equipped with a platen on which the wafer is processed. The platen can reach up to 10 N in applied pressure. The platen also has a mechanical downforce locking model. MITUTOYO MVK-H2 is also equipped with a programmable abrasive supply equipment. This allows for the precise adjustment of the grading and grain sizes as well as the amount and thickness of the abrasive layers. The system is capable of using abrasive pads with a diameter of up to 200 mm and it can also use polishing pads with a diameter of up to 350 mm. MVK-H2's polishing unit uses a high-pressure wax carrier and sintered diamond polishing pads. This ensures that the interior of the wafer remains unaffected during the process. The machine is also capable of adjusting the process parameters and polishing force levels in order to maximize the processing area and accuracy. Finally, MITUTOYO MVK-H2 is coupled with an LCD screen which can be used to make fine adjustments and monitor the process. The tool also includes a cooling and air filtering asset which help to maintain the temperature and quality of the wafers during the process. MVK-H2 is an extremely versatile and reliable machine for wafer grinding, lapping and polishing.