Used MONTGOMERY WARD WB6A #9302969 for sale
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ID: 9302969
Grinder
Belt not included
MARATHON Electric motor:
208-220/440 V, 4.8/2.4 A, 1730 RPM, 3 Phase, 1 1/2 HP.
MONTGOMERY WARD WB6A is an efficient and versatile wafer grinding, lapping and polishing equipment. It is designed to grind and polish a wide range of large diameter wafers from 2 to 450 mm, as well as small wafers from 5 to 100 mm. This system features an advanced, mechanical grinding and polishing head, which is used to grind, lap and polish a range of the substrates with varying effective diameters. The rotary grinding and polishing head, together with a set of fixtures, offers an efficient and economical way to process flat or curved surfaces, regardless of their materials. Making use of the precision grinding and polishing head, experienced technicians are able to obtain prime quality results every single time. The unit also features adjustable spindle speeds ranging from 1000 to 2000 RPM, which can be fine-tuned to required specifications. This helps to ensure that wafer surfaces are ground and polished to the desired dimensions and properties. The machine also allows for the processing of multiple substrates in one step, thereby allowing manufacturers to streamline production with minimum wastage of resources. The tool also has a dedicated cooling asset. This helps to ensure that the model dissipates heat and prevents damage due to excessive heating. This equipment also offers enhanced safety features such as a slowly activated back-up protection system which is designed to automatically shut down the unit if excessive thermal stress is detected. WB6A uses sophisticated CAD software to allow operators to easily design a process script. This script is capable of processing multiple substrates with varying effective diameters. This allows experienced operators to optimize their polishing and grinding process for each specific material characteristics. MONTGOMERY WARD WB6A wafer grinding, lapping and polishing machine is an ideal solution for the precision grinding and polishing of a wide range of substrates. Its high-quality results, advanced features and efficient process script make it both an economical and safe solution for a wide variety of industrial and commercial needs.
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