Used NAICHI FUJIKOSHI 12B-5L #9224519 for sale

NAICHI FUJIKOSHI 12B-5L Wafer Grinding, Lapping & Polishing Equipment is an efficient, effective and cost-conscience tool for achieving the precise surface finishes and exact thickness and flatness required in various semiconductor applications. This system can maximize throughput while achieving the most stringent customer requirements. The FUJIKOSHI 12B-5L Wafer Grinding, Lapping & Polishing Unit utilizes precision diamond abrasive to accurately grind, lap and polish the wafer surface. A precise control machine ensures repeatability and accuracy for precise control of the entire grinding operation. The tool has the capability to grind media from 0.5 μm to 3000 μm and to use a wide range of diamond sizes for precise surface finishing. The FUJIKOSHI is capable of simultaneously grinding and polishing up to 800 wafers in one stroke. For greater efficiency, the asset can be automated with a dedicated handling model and a comprehensive slate of input and output options. NAICHI FUJIKOSHI 12B-5L equipment is integrated with a closed-loop feedback control system with real-time visualization of the process parameters and results, allowing for precise control of the operation. The unit is equipped with a completely enclosed housing and an purification machine, making it safe and clean for use in any environment. With a user-friendly interface, operators can quickly and accurately set up the operation and manage the process. The FUJIKOSHI 12B-5L Wafer Grinding, Lapping & Polishing Tool is highly reliable and efficient, providing superior throughput and yields at a fraction of the cost of alternative solutions, making it the perfect tool for meeting the strictest requirements in semiconductor applications. The asset is built with the latest technology to enable operators to achieve high-precision results with maximum repeatability and minimal waste.