Used NAICHI FUJIKOSHI 6B-L #9276670 for sale

NAICHI FUJIKOSHI 6B-L is a wafer grinding, lapping and polishing equipment designed to produce high-precision wafers and lapping on the edges of wafers. 6B-L system is designed to process round or rectangular wafers of any size up to 200mm in diameter and up to 16mm thick. The unit comes equipped with two independent grinding and polishing platforms, a built-in lapping plate, and a pressure plate to press the wafers against the plate during the lapping process. The machine also uses the latest grinding technologies, powered by a specially designed 3-phase motor, to ensure uniform and tight grinding. Additionally, a "mirror effect" polishing method is used to help achieve extremely high levels of precision and uniformity. NAICHI FUJIKOSHI 6B-L tool includes a proprietary, high-precision sub-surface grinding and lapping machine, making possible the production of high-quality and precision wafer lapping operations. The process starts with a lapping plate loaded with the wafers, which is then moved to the sub-surface grinding and lapping machine, where the wafers are ground and lapped. Afterward, the lapping plate is moved to the pressure plate, and the wafers are pressed against the lapping surface, allowing for flat surface grinding and polishing. Finally, the polished wafers are subject to "mirror effect" surface polishing, which helps further increase the precision and uniformity of surface finish. 6B-L wafer grinding, lapping and polishing asset is designed to produce high-precision wafers for use in semiconductor and other electronics applications. It can process round or rectangular wafers up to 200mm in diameter and up to 16mm thick. The model can provide extremely uniform, tight grinding and lapping, and a "mirror effect" polishing method is used to help achieve extremely high levels of precision and uniformity. Overall, NAICHI FUJIKOSHI 6B-L equipment is an excellent choice for producing high-quality and precision wafers.