Used NAICHI FUJIKOSHI 9B-5L/P #9073244 for sale

NAICHI FUJIKOSHI 9B-5L/P is a wafer grinding, lapping, and polishing equipment produced by the Tokyo-based company Naichi Fukikoshi. This system is capable of precision grinding, lapping, and polishing of hard and soft materials such as semiconductor substrates. 9B-5L/P is equipped with a powerful, 30 KW spindle motor and is capable of machining wafers with a diameter of up to 150 mm. It has a hydrostatic bearing unit with a working range of 0.01 µm - 0.1 µm that enables precision grinding, lapping, and polishing of the wafers to a finish of 0.1 µm - 0.002 µm. The machine is further enhanced with an automatic wafer loader, an automatic surface inspection tool, an in-process monitoring asset, and an industrial-grade chiller for cooling the grinding tools. Moreover, it has a slurry control model that prevents cross-contamination of the polishing surface. The overall structure of the 9B-5L/P includes four main components: the Work Station, Lap Station, Polishing Station, and Control Unit. The Work Station is the main component of the equipment, containing the spindle motor, high-precision linear guide, and a high-speed, high-accuracy electronic controller. It is capable of controllable speeds ranging from 1,000 to 6,000 rpm and has built-in vibration suppression. The Lap Station contains two sets of lap holders that support the lapping plate, diamond-impregnated plated abrasives, pad holders, and a coolant system. The Polishing Station holds the polishing pad, provides the force and pressure to the pad, and houses the in-process monitoring unit. The Control Unit contains the units for data acquisition, data processing, and results display. Overall, NAICHI FUJIKOSHI 9B-5L/P is a robust and highly precise wafer grinding, lapping, and polishing machine, offering significant savings in time and cost compared to conventional methods. It is suitable for precision machining of substrates, metals, and ceramics, and is capable of achieving micron-level surface finishing.