Used NAICHI FUJIKOSHI 9B-5L #9276673 for sale

NAICHI FUJIKOSHI 9B-5L is a wafer grinding, lapping and polishing equipment designed for use in semiconductor manufacturing. This system is reliable and efficient, able to grind, lap, and polish 6" and 8" diameter semiconductor substrates with a maximum thickness of 6mm. The process involves two stages. In the first stage, 9B-5L's dual, concentric grinding wheels bring rough grinding motions in order to reduce the thickness of the substrate and create a uniform surface. After grinding, the wafer is mounted on the polishing tool, which uses lapping to achieve the desired level of thinness and concentration. This stage is aided by the unit's precision spindle mechanism, which helps adjust the height of the wafer for greater accuracy. In the second stage, the machine makes use of its single-axis polishing head and 300mm wheel to polish the substrate and achieve the desired surface finish. Thanks to the tool's in-line polishing action, particles from the polishing process can be removed easily and quickly, ensuring an efficient end-result. In addition, NAICHI FUJIKOSHI 9B-5L is equipped with a range of safety features, including an operator safety bar and a dust collection asset, which helps prevent worker exposure to potentially hazardous particles. 9B-5L is an essential model for the high-precision wafer grinding, lapping and polishing work that is critical for modern semiconductor production. It is robust, efficient, and cost-effective, and with its range of safety features, provides users with a reliable and safe means of producing high-quality semiconductor substrates.