Used NAICHI FUJIKOSHI 9B-5L #9276674 for sale

NAICHI FUJIKOSHI 9B-5L is a fully automated Wafer Grinding, Lapping & Polishing equipment. This system is suitable for use in the manufacture of compound semiconductor and other material wafers. 9B-5L is designed to process finished components with a high degree of precision, and features an adjustable high-powered spindle and multiple grinding surfaces. NAICHI FUJIKOSHI 9B-5L has a base plate featuring a cover plate that can be lifted off to allow for the removal of any finished components during the manufacturing process. The base plate is designed to have a maximum load of up to 500 kilograms. The spindle is powered by a single-phase AC 3-phase motor which has a maximum speed of 1,700rpm. The spindle is mounted on the base plate and is adjustable in height to allow for the grinding, lapping and polishing of components of various sizes and thicknesses. 9B-5L also features a grinding platform with evenly spaced multifunctional grinding surfaces, designed to accommodate various sizes and thicknesses of wafers. These grinding surfaces include an ultra-fine diamond lapping surface, a cup wheel and a microgrinder surface. The machine also features adjustable diamond grinding heads, which are used to further refine the surface to produce high-quality results. In addition to the grinding platform, NAICHI FUJIKOSHI 9B-5L comes with a Coolant Unit. This machine is designed for the minimization of thermal distortion of the components during the manufacturing process. The coolant tool helps with the efficient passage of coolant through the grinding surfaces as well as to prevent the grinding tools and components from becoming overheated. 9B-5L is also able to utilize pressurized lubricant for parts that require a higher degree of lubrication. Finally, NAICHI FUJIKOSHI 9B-5L features an Automatic Wafer Feeding & Unloading Asset. This model is designed to keep the working area free from debris, as well as to reduce the amount of time needed to reload wafers onto the grinding platform. The equipment is also designed for the safe handling of the wafers to lessen the risk of damage or contamination. 9B-5L is a robust and fully automated wafer grinding, lapping and polishing system that offers a high degree of precision and accuracy. The unit is suitable for use in the manufacture of any number of materials and is easily adjustable to accommodate various sizes and thicknesses of wafers. In addition, NAICHI FUJIKOSHI 9B-5L has various safety features such as the coolant machine and automatic wafer loading and unloading tool. Thus, it is the ideal asset for any grinding, lapping and polishing applications.