Used NAICHI FUJIKOSHI LPD 300 #293666897 for sale

NAICHI FUJIKOSHI LPD 300 wafer grinding, lapping and polishing equipment is a versatile and reliable machine for achieving optimum grinding and polishing results. This system provides an excellent surface finish for single- and multi-layer wafers of various geometries. With three diameters of platens to choose from, NAICHI FUJIKOSHI LPD-300 offers flexibility for processing diameters up to 300 mm. LPD 300 is equipped with a powerful, brushless direct current motor and digital frequency control which efficiently deliver both low-rpm and high-rpm operations. The machine has a two-stage speed adjuster so that both rotational speeds can be changed depending on the application. The variable speed allows for efficient process control to achieve a perfect finish. An auto-balance unit keeps the wafers well balanced around the platen while they are being polished, ensuring they do not wobble or vibrate. The Lapmaster grinding and back lapping drum uses non-abrasive diamond slurry on top of a heavy-duty cylinder that continually rotates the wafers at a precise speed. This creates a controlled environment for grinding and polishing, eliminating the possibility of excessive pressure or damage to the wafers. LPD-300 is controlled by a easy-to-use touch panel where process parameters such as speed, time and rotation direction can be adjusted with the push of a button. The machine also has an indicator for the state of the grinding and polishing process to assist the operator in achieving the desired results. The machine's built-in data logging tool allows for better servicing records and process data collection for future jobs. NAICHI FUJIKOSHI LPD 300 is a robust and reliable machine for efficiently achieving a great finish for wafers in a wide variety of applications. The machine's precision controls, intensive construction and auto-balancing features ensure that the process is consistently high quality and yields the best results each time.