Used NAICHI FUJIKOSHI LPD 300 #9122938 for sale

NAICHI FUJIKOSHI LPD 300 is a comprehensive wafer grinding, lapping, and polishing equipment designed for grinding and polishing wafers used in the semiconductor industry. With its automated processes and high precision capabilities, NAICHI FUJIKOSHI LPD-300 offers an efficient and cost-effective solution for grinding and polishing wafers. The system is equipped with two head-style grinding heads that can be set for sequential grinding, lapping, and polishing. The first head is used for the coarse or preprocessing stages of grinding, lapping, and polishing, while the second head is used for the fine processing stages. The adjustable grinding roller speed can be set anywhere from 10 to 350 rpm, allowing for better control over the grinding, lapping, and polishing processes, while the carousel-style equipment supports various wafer sizes up to 300 mm. The unit is also equipped with a self-cleaning design that eliminates the need for manual cleaning and maintenance. The cleaning process involves a high-speed oscillation that can remove debris and contaminants, protecting the wafers from contamination and allowing for increased yields. The machine also includes an automatic wafer transport tool that helps to ensure that the wafers are securely and safely transported from one stage of the process to the next. For example, the perforated grinding pad helps to provide uniform grinding, lapping, and polishing processes that help to increase overall yields. The asset also includes an automated engine that allows for operation with various settings to meet specific process requirements. This includes a programmable grinding mode, lapping mode, and polishing mode that can be adjusted according to the shape, size, and material of the wafers. This makes LPD 300 suitable for use in various manufacturing environments. LPD-300 also includes a high-resolution imaging model that allows for defect detection and diagnosis. The imaging equipment also helps to ensure that the final wafers are free from errors during grinding, lapping, and polishing. Overall, NAICHI FUJIKOSHI LPD 300 is a comprehensive wafer grinding, lapping, and polishing system that is designed to meet the needs of the semiconductor industry. With its automated processes, self-cleaning design, precise control capabilities, and automated wafer transport, the unit offers an efficient, cost-effective solution for grinding, lapping, and polishing wafers.