Used NAICHI FUJIKOSHI LPD 300 #9223002 for sale

NAICHI FUJIKOSHI LPD 300 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed specifically for automated production environments. The system is sophisticated enough to serve complex parameters for advanced microelectronic applications and can be used for wafer and die level grinding, lapping, and polishing processes to achieve outstanding surface quality and improved uniformity. The machine is equipped with a high-precision alignment camera unit and a 7-axis robot to ensure fast and accurate robotic movement, and is optimized to provide a reliable and repeatable interface for all process operations. The integrated optical profile measurement machine allows for rapid wafer and die level inspection for quick feedback on both grinding and polishing processes. This minimizes human intervention and increases process control. The machine has a mechanical frame constructed from CNC precision machined parts for superior rigidity and repeatability, equipped with an electric drive for precise and efficient control of each axis. In addition, a grinding pressure adjustment tool allows near-optimum accuracy to adapt to changing process requirements. The machine offers a fully automated and programmable interface for easy control of all process operations. NAICHI FUJIKOSHI LPD-300 is designed with an adjustable temperature control asset for optimizing the working environment, and the machine is also equipped with a dust collection model for improved process safety. Furthermore, it is equipped with a cooling equipment to ensure minimum thermal impact on the wafer surface during grinding and polishing processes. To provide a reliable and high-quality wafer grinding, lapping, and polishing process, LPD 300 is also equipped with a double-sided grinder with a unique miller element that can be used for both flat and curved surfaces which improves wafer uniformity. Furthermore, it is also equipped with a control module for manual control, as well as an integrated programmable logic controller (PLC) unit for fully automated production. Overall, LPD-300 is a high-performance, high-precision wafer grinding, lapping, and polishing system designed to meet the needs of sophisticated automated production environments. It is ideally suited for processes that require stringent control over wafer particle size, uniform surface finish, shape, and dimensions.