Used NAICHI FUJIKOSHI LPS38S-R-1-ACW #9237179 for sale

NAICHI FUJIKOSHI LPS38S-R-1-ACW wafer grinding, lapping, and polishing equipment is designed for precision and control in wafer fabrication. It is especially well-suited for low-profile and high-aspect ratio wafers of sizes up to 3x6 in (75x150 mm). The system features a precision tabletop grinder, a closed-loop rectification lapping procedure for precise profile control, a fast and accurate rectification rate, and a variable speed polishing motor that allows both high- and low-speed polishing to meet the most demanding requirements. LPS38S-R-1-ACW wafer grinding, lapping, and polishing unit is equipped with a Nachi Fujikoshi grinding wheel that ensures superior edge rounding accuracy and consistent corner relief due to its unique calculated processing parameters. The machine also has a spindle speed of up to 24,000 rpm, which greatly increases speed for both grinding and lapping applications. The grinder uses a high-resolution feed control to consistently reduce the wafer, and its compact size makes it ideal for use on production lines. The proprietary diamond lapping disc is designed to guarantee accuracy and precision in the lapping process. The adjustable rotating speed allows for the adjustment of the lapping speed to determine the profile accuracy over extended periods. Furthermore, it helps maintain peak edge rounding, gap control, and more uniform wafer surface. In the polishing application, NAICHI FUJIKOSHI LPS38S-R-1-ACW tool has an adjustable speed polishing motor, variable polishing speed settings, and a programmable timer to ensure that polishing quality is maintained for each application. The motor also features an eco-friendly low-consumption design. This asset's electrical insulation also provides insulation protection from static electricity when grinding and lapping. Overall, LPS38S-R-1-ACW wafer grinding, lapping, and polishing model is a powerful and reliable equipment for wafer fabrication. With its advanced grinding and polishing features, it provides an excellent solution for precision and detailed work on any size and shape of wafer. Its closed-loop rectification lapping procedure ensures accurate profile control and consistent high-quality results. The adjustable speed polishing motor also allows the user precise control over the polishing process.