Used NAICHI FUJIKOSHI MCP 302 #9085599 for sale

NAICHI FUJIKOSHI MCP 302 is an advanced equipment for wafer grinding, lapping and polishing. It is specifically designed to process both ferrous and non-ferrous materials, including semiconductor and optoelectronic components. It is ideal for achieving a high level of flatness and surface finish perfect for high yield devices in the semiconductor and wiring assemblies. MCP 302 features a unique 3-axis positioning system which allows precise control of each wafer's geometry, ensuring high quality finishes. This is complemented by an automated grinding and lapping process which delivers flat surfaces with tight tolerances. The unit is also able to grind up to two wafers at once, increasing the throughput speed with further control over the grinding process. NAICHI FUJIKOSHI MCP 302 also features advanced intelligence for wafer detection. This permits to detect the optimum grinding and lapping speed thus reducing production costs. Furthermore, the machine is designed for easy operation with an intuitive graphical user interface and user-friendly controls. MCP 302 is able to achieve excellent results in wafer grinding, lapping and polishing as well as hard and soft material processing. Its high point-to-point accuracy and advanced wafer detection tool enable precise surface finishes with high quality and reliability. Furthermore, its ergonomic design further enhances the asset's efficiency in terms of material and labor costs. All in all, NAICHI FUJIKOSHI MCP 302 is the perfect solution for wafer grinding, lapping and polishing in a variety of industries. Its precise materials processing capabilities, along with its simple operation and cost efficiency, make it the ideal industrial choice.