Used NAICHI FUJIKOSHI MCP 302 #9122939 for sale

NAICHI FUJIKOSHI MCP 302 is a wafer grinding, lapping, and polishing equipment designed for grinding and/or polishing large diameter silicon wafers, substrates, or thin film-deposited materials. The system features advanced features such as automatic in-situ metrology, auto-load & unload unit, a variety of polishing and lapping plate options, as well as edge and back grinding functions. The grinding and polishing process begins with high-accuracy, high-magnification pre-processing followed by CMP-ready grind and polish process. The device is equipped with a stationary spindle that can grind and polish wafers up to 8-inch in diameter at a high rate of speed. This spindle can be modified to enable edge grinding and back grinding as needed. The spindle also features an air bearing machine where air pressure is leveraged to rotate the spindle at high speed and maintain accuracy/constancy of motion. The device further features automatic in-situ metrology to ensure high accuracy of grinding, lapping and polishing operations and provide feedback to streamline these processes. In addition, MCP 302's auto-load and unload tool help to reduce handling costs and cycle time. It can also be equipped with a variety of polishing and lapping plates to provide maximum surface conditioning. In terms of safety and reliability, NAICHI FUJIKOSHI MCP 302 is made of high-grade materials such as stainless steel and anodized aluminum, and is designed with built-in protection systems such as a lid guard and interlock sensor. The well-developed software helps to further configure the asset to meet process requirements and maintain optimal results. The model is also compliant with current standards such as ISO 9001 and CE Mark. In summary, MCP 302 is an advanced wafer grinding, lapping and polishing equipment that is designed to meet the demand for high-accuracy results. It has the capability to grind and polish wafers up to 8-inch in diameter and is equipped with advanced features such as in-situ metrology, auto-load & unload system, and a variety of polishing and lapping plate options. Safety and reliability are also ensured with the use of high-grade materials and well-developed software.