Used NAICHI FUJIKOSHI NSP50N #9143489 for sale

NAICHI FUJIKOSHI NSP50N is a precision, multi-functional wafer grinding, lapping & polishing equipment designed for use in semiconductor fabrication processes. It features a fully automated system and can process 2", 3", 4" & 6" square wafers up to 300mm thick. The unit incorporates a single axis, centering robotic arm which is designed to provide consistent quality of surface finish on various parts and can be used for both single and multisided wafer processing. The grinding stage of NSP50N utilizes a rotary spindle which is designed to provide high removal rates of material while also delivering excellent surface finish. It also features two flexible support discs which allow for minimal stock removal and minimize wafer breakage. The lapping and polishing stage utilizes a 10-stage continuous motion that provides a highly efficient and uniform process for a wide range of wafer thicknesses and topographies. NAICHI FUJIKOSHI NSP50N also features a waterjet pump and cooling unit to minimize wafer breakage and ensure a quality surface finish is obtained. The waterjet pump utilizes a variety of different nozzle sizes allowing for greater adjustment of process parameters. Additionally, NSP50N includes a dust collection machine which ensures that the contamination in the working environment is minimized. NAICHI FUJIKOSHI NSP50N also features an advanced robotic arm for centering wafers, this allows for accurate centering and consistent surface accuracies across different wafer types and sizes. This feature also allows for accurate and repeatable positioning of the wafer working surface relative to the grinding/lapping/polishing tools, helping to consistently achieve the desired result. Finally, NSP50N has various safety features in place to ensure that its usage follows strict industrial standards. This includes emergency stop buttons, emergency inspection windows with built in light beam sensors, and an interlocked safety cover for extra protection. NAICHI FUJIKOSHI NSP50N also features an intuitive full graphics user-interface ensuring efficient operation and programming of the machine. In summary, NSP50N is an advanced, multi-functional wafer grinding, lapping & polishing tool designed for use in the semiconductor fabrication process. It features a single axis centering robot arm, rotary spindle grinding, 10-stage continuous motion lapping and polishing, water jet cooling, dust collection, accurate wafer centering, and various safety features. This asset ensures efficient and reliable wafer processing and consistent quality surface finishes over a wide range of wafer sizes and thicknesses.