Used NAICHI FUJIKOSHI NSP50N #9258193 for sale

NAICHI FUJIKOSHI NSP50N is a wafer grinding, lapping and polishing equipment by NAICHI FUJIKOSHI that allows for cutting-edge and precision surface treatments of silicon wafers. Used for preparation of wafer products prior to application, NSP50N features an integrated machine design that allows it to effectively clean, grind, lap and polish wafers to a desired degree. Utilizing a spindle motor, NAICHI FUJIKOSHI NSP50N systems feature a grinding wheel with a revolution speed of 6,000 rpm for higher-speed working. The spindle motor also allows for excellent stability and sharp cutting during grinding operations. Additionally, there are two separate grinding wheels to allow for efficient feed rates and different levels of grinding control. The first grinding wheel is made from diamond to provide the best cutting surface for polishing and the second wheel is designed for grinding silicon wafers. NSP50N utilizes a diamond lapping plate to enable superior lapings. The system regulates the pressure of the lapping plate until a predetermined depth of lapping is achieved. This ensures uniformity and accuracy in the polishing process with minimal damage to the silicon wafers. The polishing process of NAICHI FUJIKOSHI NSP50N is also precise due to the inclusion of a polishing slab with a revolution speed of approximately 10,000 rpm. During this process, the leakage amount and slurry delivery rate of the polisher are also controlled to ensure polishing with minimal damage to the silicon wafers. Furthermore, NSP50N has a cleaning mechanism to apply cleaning agents to each wafer to create uniform and clean surfaces prior to polishing. Finally, NAICHI FUJIKOSHI NSP50N has a highly reliable, low-noise, and dust-proof unit design to ensure a safe operation space for users. The machine's noise levels are under 50dB, and the body is made corrosion-resistant with an electroless nickel plating to withstand tough environmental conditions. Overall, NSP50N is a reliable and efficient wafer grinding, lapping and polishing tool. With a robust machine design, multiple grinding wheels, a lapping plate, a polishing slab, and several safety features, the asset enables highly precise grinding, lapping and polishing of silicon wafers and other substrates.