Used NAICHI FUJIKOSHI SLM-12AL #9107271 for sale

NAICHI FUJIKOSHI SLM-12AL is a wafer grinding, lapping and polishing equipment specifically designed to improve the efficiency of the process of surface grinding and lapping wafers. This system features a compact design and incorporates a modular setup so that it can accommodate a variety of wafer sizes and shapes. The unit also features a highly efficient lapping mechanism that is capable of grinding, lapping, and polishing several wafers simultaneously. SLM-12AL is a unique automated machine that can accommodate a variety of wafer size and shape configurations and can process a maximum of 8 wafers simultaneously. The tool is designed for use in the semiconductor industry, as it features specific components designed to ensure precision grinding and lapping processes. NAICHI FUJIKOSHI SLM-12AL is equipped with two motorized grinding heads that are mounted on a fixed platform and allows up to four wafers to be processed at the same time. The grinding heads are able to rotate, allowing for optimal and efficient contouring of the wafer's surface. The grinding heads can also be configured to grind in the X and Y directions as well as in the diagonal direction. The lapping mechanism on SLM-12AL is also highly unique, and it is designed to allow a large amount of wafers to be lapped on a single disc simultaneously. The asset is capable of performing both lapping and polishing processes on up to three times the wafer count compared to traditional lapping equipment. Additionally, the unit is equipped with a flow model that ensures a uniform distribution of grit during the lapping process. The equipment can also be equipped with an automated wafer loading system. The automated loading and unloading unit is designed for discrete, fast, and precise handling of wafers. This machine can be configured to include additional support for a wide selection of wafer sizes and shapes. Additionally, this loading tool features a flexible feeding asset to ensure wafers are securely held during the entire process. NAICHI FUJIKOSHI SLM-12AL is an efficient and cost-effective model for wafer grinding, lapping, and polishing. This equipment is designed to be an innovative tool for the semiconductor industry, enabling efficient and precise processing of large volumes of wafers.