Used NAICHI FUJIKOSHI SLM-140 #9050531 for sale

NAICHI FUJIKOSHI SLM-140 is a wafer-grinding, lapping, and polishing equipment used as an integrated two-step process to refine substrates. Its base is an easy-to-use machine integrated with air actuators and high-precision servomotors. SLM-140 is designed for efficient and precise grinding, lapping, and polishing of a variety of wafer sizes, from 2 inch to 8 inch. The system combines a number of features to ensure high-end quality across the wafer substrates being worked on. Its segmented grinding wheel provides uniform results across the entire wafer surface while eliminating wafer breakage due to non-uniform grinding. The lapping/polishing stage includes a precision pressure controlled spindle head to reduce surface roughness and deliver high-end part-to-part consistency. NAICHI FUJIKOSHI SLM-140 is capable of Roughness Average (Ra) measurements of 0.3 μm on both sides of a wafer substrate. The unit is also designed to process large-capacity wafers at high speed, producing the highest quality finish. SLM-140 is equipped with a vision machine, as well as a variety of automation options, to enable its use across a wide variety of applications. The integrated vision tool can be used to locate, inspect, and display features on the wafer substrates. This asset also allows for quick and accurate machine set-up, model diagnostics, and calibration. Its automation options include a computer numerical control (CNC) function, interconnected machine-machine communication, and a monitoring equipment that provides detailed information regarding the parameters of the grinding and lapping/polishing stages. NAICHI FUJIKOSHI SLM-140 is an advanced system, designed for efficient and precise grinding, lapping, and polishing of a variety of wafer sizes. With its segmented grinding wheel, precision pressure-controlled spindle head, integrated vision unit, and automation options, SLM-140 is capable of delivering high-end quality at high speeds.