Used NAICHI FUJIKOSHI SLM-140 #9050570 for sale

NAICHI FUJIKOSHI SLM-140 is a state-of-the-art wafer grinding, lapping and polishing system, designed for a range of different industrial processes requiring high precision solar cell and wafer fabrication. This industry leading grinding machine offers an efficient and cost-effective solution for surface modification through grinding of semiconductor and optoelectronic materials. SLM-140 is characterized by its compact design and user-friendly operation, making it a suitable choice for even the most demanding of processes. The machine consumes low power and is able to generate high accuracy lapping and grinding, while consuming little energy, making it an economical and resource-effective choice. Additionally, the system features a wide range of abrasive grades to suit any process. The grinding and lapping process is two-sided, allowing for the grinding to be concentrated in one direction or simultaneous grinding of both sides of the wafer. NAICHI FUJIKOSHI SLM-140's lapping head design offers adjustable constant applied forces, making it easy to set and modify the grinding parameters and pressure for optimal results. This extendable grinding head offers increased flexibility and precision for continuous and repeatable grinding processes. The polishing of the wafer is carried out using a hard cloth wheel and compound paste to generate a mirror finish. The wheel and paste are designed to reduce friction helping to minimize damages to the surface of the solar cells and wafer, allowing for more accurate grinding and polishing methods. SLM-140 meets safety energy and resource standards making it an ideal product suitable for most production environments. The product is also available with a range of extra accessories such as cooling systems and grinding fluid tanks, adding to its diverse abilities to suit different production and grinding requirements. In conclusion, NAICHI FUJIKOSHI SLM-140 is an industry leading wafer grinding, lapping and polishing system ideal for the requirements of many different processes. Its user-friendly design and large range of features, including its low consumption power and adjustable constant applied forces, make it the ideal choice for high precision wafer processing.