Used NAICHI FUJIKOSHI SLM-40T #9156017 for sale

NAICHI FUJIKOSHI SLM-40T is a high performance wafer grinding, lapping and polishing equipment that enables the processing of fragile, delicate semiconductor wafers at a low cost. The system's features enable it to provide precise and repeatable finishes, with surface quality at or exceeding industrial standards. It is equipped with a wide variety of processing modes, from simple lapping and polishing to wet chemical grinding, all of which can be configured for specific applications. SLM-40T includes a modular wafer carrier that can accommodate up to eight 200mm-sized wafers at once, for simultaneous processing. It utilizes high speed, fixed frequency grinders, a high power diaphragm pressure pump for controlling slurry flow, and a three-stage high repeatability, three-axis carrying arm unit. The machine is driven by a powerful four-axis CNC servo tool, and the combination of this, along with a load cell asset, allows for precise control of grinding forces during operation. In operation, the wafers are precision loaded into the wafer cassettes and then loaded onto the carrier. During the grinding process, the wafers are securely held in place by the three-axis carrying arms, and the grinders are brought into contact with the wafers with a controlled surface force. The uniform contact pressure between the wafers and the grinders ensures a consistent and uniform finish on each wafer. Once the grinding process is complete, the wafers are then loaded onto a precision lapping and polishing platform. The platform features a floating mount combined with a low frequency vibration and a vacuum model to securely hold each wafer in place during the polishing and lapping process. A range of polishing pads and abrasive slurries is available, enabling the fine polishing of wafer surfaces with a consistent finish. NAICHI FUJIKOSHI SLM-40T Wafer Grinding, Lapping & Polishing equipment is a reliable and cost-effective system that ensures a high quality surface finish on a range of fragile and sensitive semiconductor wafer materials. With highly precise, repeatable grinding and polishing capabilities, SLM-40T is a trusted choice for semiconductor manufacturers for accurate, consistent and cost-effective wafer processing.