Used NAICHI FUJIKOSHI SPM 15 #9085602 for sale

NAICHI FUJIKOSHI SPM 15 is a wafer grinding, lapping and polishing system designed for processing semiconductor wafers and other substrates. The machine is equipped with a motion platform that is capable of grinding, lapping and polishing wafers of various sizes with a constant surface finish. The machine utilizes advanced CNC technology, including a 3-axis CNC table and a computer controlled grinding, lapping and polishing spindle. The machine is also equipped with a 7-axis CNC table for grinding, lapping and polishing operations that require precise positioning of the rotation axis. SPM 15 is capable of diamond polishing, resulting in a superior surface finish on the substrate. It is capable of regulating the speed and pressure of the grinding, lapping or polishing operation for a controlled output. NAICHI FUJIKOSHI SPM 15 is highly flexible and can be used for a variety of applications requiring the grinding, lapping and polishing of different material types and thicknesses. It has a substantial work area of approximately 310mm x 150mm and a wide range of adjustable parameters for optimum performance. The table design, diamond grinding disks, and cutting tray all work in concert for an accurate and homogeneous result. SPM 15 features a range of accessories, including a slurry tray for easy cleaning of the grinding disks and a microscope for inspection of the ground and lapped surfaces. It also offers a complete overview of the polishing process for better control of the output. Furthermore, the machine can be programmed for remote operation and monitoring from a single control unit. The machine is designed to meet the high precision requirements of semiconductor industry and provides a high level of repeatability and accuracy. Its computer controlled operations ensure a smooth and uniform finish and the capacity for instantaneous and precise adjustments. NAICHI FUJIKOSHI SPM 15 is built for reliability, accuracy, and versatility, making it an ideal machine for wafer grinding, lapping and polishing.