Used NAICHI FUJIKOSHI USL-12B #9007410 for sale

NAICHI FUJIKOSHI USL-12B is a high-precision wafer grinding, lapping & polishing equipment that can be used for high-quality, high-yield and cost effective production of 300mm-1000mm semiconductor wafers. The system is designed with a unique, proprietary dual-staged grinding head for increased speed and productivity. This makes it optimal for high-volume, high-precision applications, such as the production of memory chips. The core components of the unit are its grinding head, high-precision spindle, high-torque motor, and computer controls. The grinding head consists of two grinders: one diamond and one alumina, and is capable of "multi-stage" grinding. This allows it to perform multiple grinding processes in one pass, which increases speed and reduces downtime. The motor and spindle are both extremely powerful and accurate, allowing high-precision grinding and polishing to be achieved. The entire machine is controlled by a powerful computer to ensure that the most accurate results are achieved. In terms of safety, USL-12B is compliant with the UL, CSA, and CE safety standards, which make it suitable for use in a variety of applications. It also comes with a specialized lapping plate for high-precision operations. This allows for quick and accurate lapping without any risk of scratching or damage. The entire tool is also designed to be dust and particle free for safer, cleaner operations. NAICHI FUJIKOSHI USL-12B has a wide range of customization options that allow it to be tailored to specific applications. It is also coupled with advanced software that allows customer specific programs and settings to be created and run, allowing for easy and efficient operations. Finally, USL-12B is backed by a worldwide service network for regular maintenance and spare parts. This ensures that no matter where the asset is used, it can be easily maintained. With its combination of precision, speed, and safety, NAICHI FUJIKOSHI USL-12B is a great choice for high-precision wafer grinding, lapping, and polishing applications.