Used NAICHI FUJIKOSHI USP-15B #9099850 for sale

NAICHI FUJIKOSHI USP-15B is a wafer grinding, lapping and polishing equipment designed to provide high precision and repeatable results for a wide range of semiconductor wafer-level packaging applications. This system combines a motorized substrate carrier for precise grinding, stop/start functions, and the addition of a lapping and polishing press unit. USP-15B has two independent, manually operated accessories that further control the lapping and polishing processes, allowing for greater accuracy and repeatability. The establishment of a stable grinding pressure is accurate and repeatable. Its positioning accuracy has been greatly improved by using a 20mm diameter motorized substrate holder, allowing the process to be constantly monitored. NAICHI FUJIKOSHI USP-15B offers a unique adaptive process control machine and the option to use pre-configured settings. For lapping and polishing, pressure and speed can be adjusted according to the conditions in every stage. The addition of this tool eliminates any fluctuations in the lapping/polishing process. USP-15B also features a variable speed motor which is controlled by the user through a touch screen interface. This allows the user to speed up or slow down the lapping/polishing process when needed, resulting in optimal results. In addition, NAICHI FUJIKOSHI USP-15B can be equipped with a variety of grinding plates, customized for each application. USP-15B allows for a high-temperature, high-pressure lapping process to remove excess material, ensuring a perfectly smooth, flat, and uniform surface finish in every stage. This process allows for ultra-precise control of the groove quality, both during and after the process. Overall, NAICHI FUJIKOSHI USP-15B provides a cost-effective solution for high-precision, highly repeatable, and controllable results. With its advanced design, this tool is an ideal choice for a wide range of semiconductor wafer-level packaging applications.