Used NAICHI FUJIKOSHI USP-16B #9099851 for sale

NAICHI FUJIKOSHI USP-16B is a wafer grinding, lapping, and polishing equipment designed to provide improved surface roughness and scratch damage reduction of semiconductor wafers. The system features key components such as variable speed grind/lapping disks, media feeder, end-effector, and automated process control. The unit operates with a frequency control drive that maintains a precise rotational speed for grinding and lapping. This allows uniform results through the entire process and produces a more consistent surface finish at the end of the process. The variable speed drive machine also provides the ability to customize the process depending on the application and requirements. The media feeder allows for continuous grinding/lapping of the wafer while maintaining uniformity. The media feeder is adjustable, allowing for the media size to be easily adjusted for different grinding/lapping applications. The end-effector is designed to eliminate sharp edges and ensure a smooth polish. The automated process control tool provides customizable sequences and run times for the grinding/lapping process. It is designed to eliminate user-error and ensure consistent results. The process control asset also provides data logging and various alarms that alert the user in case of any issues during the grinding/lapping process. USP-16B model produces superior and consistent results when grinding, lapping, and polishing semiconductor wafers. It features variable speed drives, adjustable media feeders, and an end-effector that eliminates sharp edges. The automated process control equipment ensures that the process runs continuously and produces consistent results. NAICHI FUJIKOSHI USP-16B is a reliable system for producing superior grind, lapping, and polishing results of wafers.