Used NAICHI FUJIKOSHI USP-22B-5L #9276679 for sale

NAICHI FUJIKOSHI USP-22B-5L Wafer Grinding, Lapping & Polishing equipment is a multi-function, fully automatic, CNC grinding, lapping and polishing system specifically designed for high volume production in a wide range of materials. It is capable of grinding, lapping and polishing both standard and thin wafers. The unit has been designed to provide enhanced levels of accuracy and consistency to ensure the highest yield in sustainable operations. The machine utilizes an ultra-precise diamond grinding wheel and accompanying high resolution servo(s) to finely shape and finish wafers of varying sizes and materials to consistent quality standards. The grinding wheel is composed of a low-wear, diamond abrasive to reduce costs of re-sharpening and enable grinding of large round and rectangular wafers. A highly accurate servo tool is used to accurately control the position, rotation speed, and pressure applied to the work-piece. The machine includes sensors and computer-based supervision software to ensure consistent precision and efficient operation of the asset. The machine is capable of grinding wafers to +/- 5um of accuracy. The lapping model is used for achieving enhanced flatness and smoothness of semiconductor wafers and other hard surface parts. It is designed to utilize a multiple-lapping plate configuration with high-speed motors. This ensures that the area where the work-piece is lapped is always intact and ensures that the lapping process is controlled and uniform for each step. The polishing equipment provides extremely fast and smooth capabilities to ensure high surface quality. It is equipped with independent servos to control spindle and plate rotation, providing even polishing quality over the entire surface of the wafer. The system utilizes a high performing slurry to optimize removal rates and ensure high-end surface quality. The CNC controller enables the user to control the polishing process parameters through a simple GUI. Overall, USP-22B-5L is a highly automated, CNC grinding, lapping and polishing unit which has been designed for use in semiconductor wafer production. The machine utilizes a diamond grinding wheel, multiple lapping plates and high-end slurry for optimal surface finish and uniformity. The machine's ultra-precise servo tool is capable of transforming wafers of varied sizes and materials into a product ready for shipping. The degree of accuracy and repeatability make this asset an excellent choice for efficient wafer processing.