Used NAICHI FUJIKOSHI USP-6B #9400316 for sale

NAICHI FUJIKOSHI USP-6B Wafer Grinding, Lapping & Polishing equipment is an advanced wafer processing system designed to facilitate ultra-precise surface finishing. With a variety of features and high accuracy, this unit is designed to provide excellent performance for a wide range of applications. The NAICHI USP-6B consists of a top loading carrier unit and a lower support chamber. The carrier unit is designed to accommodate up to 6 single wafer carriers for processing. The lower support chamber houses a variety of components including the airtight mechanical seal, polishing plate, grinding plate and wafer changer. Each component can be independently adjusted to meet the specific wafer processing requirements of the application. The NAICHI NAICHI FUJIKOSHI USP-6B is designed to grind, lap and polish the surface of silicon, ceramic and other semiconductor wafers with a superior level of accuracy and efficiency. Utilizing an airtight mechanical seal, the wafers can be processed without needing to be removed from the machine. The grinding plate also has an adjustable depth that can be precisely set to match millimeter accuracy on the wafer surface. The tool is easy to use and user friendly, providing a LCD monitor and touch screen for easy set up and operation. In addition, the NAICHI USP-6B has a series of safety features designed to protect the wafers from damage such as crash locks and anti-shock absorbers. The NAICHI NAICHI FUJIKOSHI USP-6B is a powerful wafer grinding, lapping & polishing asset able to accurately process a variety of wafers including ultra-thin, low expansion, and non-conductive wafers. The model offers precision and reliability with easy operation, providing excellent value for a wide range of applications.