Used NAICHI FUJIKOSHI USPL-12B #9276676 for sale

NAICHI FUJIKOSHI USPL-12B is a professional grade "wafer grinding, lapping, and polishing" equipment capable of achieving high end finish quality for substrate preparation applications. The system features a 12-inch grinding, lapping, and polishing belt that is driven by a powerful servo-motor based mechanism. This enables a constant level of grinding at a high rate of speed for increased productivity and a more accurate finish. The grinding, lapping, and polishing head is adjustable in order to accommodate a variety of substrate shapes and sizes. The unit also features a pressure compensation chamber that allows for seamless application of grinding, polishing, and lapping pressure control. This allows for a consistent application of pressure across the entire wafer surface, thus creating a more even finish and higher quality result. The grinding surface is divided into an upper surface and a lower surface. The upper surface is the grinding station and the lower surface is composed of lapping and polishing plaques. The grinding station is fitted with a plate that is designed to minimize disruption of the grinding operation. The lapping and polishing plaques are also adjustable, allowing for a wide range of backlash to be adjusted to achieve a perfect finish. USPL-12B wafer grinding, lapping, and polishing machine also uses a vacuum tool for improved cooling during the polishing process. This ensures a smooth and even finish that is highly sought after. An easy to use touch screen is also included for a user friendly experience. NAICHI FUJIKOSHI USPL-12B wafer grinding, lapping, and polishing asset is capable of achieving a superior finish quality even on the most difficult substrates. With its powerful servo-motor drive, adjustable grinding, lapping, and polishing components, pressure compensation chamber, easy to use touch-screen, and cooling model, this equipment is an excellent choice for industrial-grade substrate preparation applications.