Used NAICHI FUJIKOSHI USPL-12B #9276678 for sale

NAICHI FUJIKOSHI USPL-12B is a wafer grinding, lapping and polishing equipment designed to facilitate an efficient and precise semiconductor wafer processing operation. It is comprised of an automated grinding, lapping and polishing unit that allows the user to achieve consistently high levels of process control and performance. The system is designed with a variety of features to provide optimal results during material processing. Included in the unit is an integrated grinding and polishing unit that features an automated grinding head, a sliding table, and a rotary grinding plate. The grinding head is designed to rotate through a range of angles in order to achieve a desired wafer profile. The sliding table allow for for the loading and unloading of wafers during the grinding process. The rotary grinding plate provides access to the wafers in the interior area of the grinding plate and allows for precise control during the grinding process. The lapping process is managed by a gas-plasma lapping unit which is designed to produce reliable, repeatable results. The unit includes a ceramic substrate, adjustable gas valves, and a variable-rate rotary motion for the lapping process. This ensures that the levels of impurities are sufficiently removed during the lapping process. The polishing process is managed by a variable-rate polishing head. The head can be adjusted to accommodate various wafer profiles and features a vacuum plate to hold the wafers during the polishing process. An integrated spindle drive machine and variable-rate control tool ensure consistent results across the range of wafer profiles. The asset also features a wafer-drying station for removing excess moisture from the wafers prior to the polishing process. USPL-12B wafer grinding, lapping and polishing model is designed to offer a high level of accuracy, process control and overall performance. It is suitable for the processing of a range of wafer sizes, profiles, and materials. Its integrated grinding, lapping, and polishing units reduce the complexity and cost associated with semiconductor wafer processing.