Used NELMOR RG1215-M1 #9114116 for sale

NELMOR RG1215-M1 is a powerful wafer grinding, lapping and polishing equipment designed for maximum performance in semiconductor processing, MEMS fabrication and other related applications. The system consists of an advanced two-axis grinding head, a double-sided lapping table and an optional wheel polishing station. The two-axis grinding head is composed of a grinding motor, a grinding wheel, and a high accuracy rotary servo motor. The rotary servo motor is capable of controlling the rotation of the grinding wheel with accuracy in 0.01° increments. The precise control allows for the accurate and higher performance grinding of wafers. It is even suitable for grinding at low speeds to reduce the wear of the grinding wheel. The integrated automatic Z-axis of the grinding head enables the precision grinding of features on the wafer. The lapping table is designed to allow the flat lapping and polishing of wafers on either side by using free-floating diamond pads. It is capable of lapping both sides of wafers in one pass. Each lapping table can contain up to 20 wafers at once, enabling high throughput. The built-in data logging unit provides data such as processing time, lapping mode and force applied. The optional wheel polishing station can be used to finish off lapped or ground wafers. It is capable of executing high-precision surface polishing on both sides of a wafer simultaneously. The station includes a polishing motor, four polishing wheels and a spindle motor. The rotary motion of the spindle motor and the polishing motor can be precisely controlled in 0.1° increments to ensure a highly accurate and repeatable process. In conclusion, RG1215-M1 is a superior wafer grinding, lapping and polishing machine for semiconductor processing. It is capable of grinding, lapping and polishing wafers with high precision, accuracy and repeatability.