Used NIDEK ME-1200 #9211120 for sale

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ID: 9211120
Multifunction edger Includes: NIDEK 3D Drilling grooving multifunction edger ME-1200 PLB-8S NIDEK ICE 1000 Autoblocker NIDEK ME-1200 Manual (2) Water valves (2) Pipes Selection of lens drill Blocks SIP 4018 Stickers Pliers Lens material: CR-39 High index plastic Polycarbonate Acrylic resin Trivex Polyurethane lenses Polishing: Beveling Flat edging Safety beveling Type PLB-8S: Finishing wheel for plastic lenses: Diameter: 100 mm Width: 16 mm Polishing wheel: Diameter: 100 mm Width: 15 mm Finishing wheel for high base curve lenses: Diameter: 100 mm Width: 17 mm Roughing wheel for plastic lenses: Diameter: 100 mm Width: 21 mm Total: 69 mm.
NIDEK ME-1200 is a critical component in the fabrication of industries such as semiconductors, electronics, and optics. This all-in-one wafer grinding, lapping, and polishing equipment enables highly precise and ultra-fine fabrication of wafers and samples by providing quick, yet accurate and repetitive operations with its automated user-friendly operation. ME-1200 utilizes an integrated motor system with dual shaft structure for an even, precise grinding operations on the surface of the samples that results in smooth surfaces even at high rotational speeds. This dual shaft unit has two grinding discs that move in contra-rotation from each other, without leaving marks on the sample's surface. The machine can grind samples up to 12 inches in diameter, with a grinding speed ranging from 25-3000 rpm. For lapping and polishing, NIDEK ME-1200 features two variable speed lap disks, each capable of lapping or polishing at up to 700 rpm. The distinct advantage of ME-1200 compared to other single purpose machines is that it can be used for grinding, lapping, and polishing in one tool. The lapping time, disc and pitch settings, and the travel speed are all adjustable to optimize the lapping process for different size samples. The asset also features two loading/unloading mechanisms, which allows for efficient loading of samples into the model, as well as efficient unloading into a waste container to prevent contamination. The sample holder is equipped with an alignment equipment which guarantees exact positioning of samples on the holder, enabling consistent grinding/lapping results. NIDEK ME-1200 utilizes a real-time feedback control system to ascertain accurate and repeatable processing results. This unit monitors the cutting parameters as the samples is being processed and can then be set to run as specified. The control machine also has a closed-loop tool that allows for fine-tuning of the results obtained, giving users comfort that the job will be completed accurately and efficiently. Overall, ME-1200 is an efficient and reliable tool for wafer grinding, lapping, and polishing operations. Its automated features and versatility make it suitable for many different industries and applications, which makes it a powerful and cost-effective tool for fabricating highly precise and ultra-fine devices.
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