Used NIHON MICRO COATING HT-301NB #293667174 for sale

NIHON MICRO COATING HT-301NB is a versatile wafer grinding, lapping & polishing equipment designed to be used in a variety of applications. Its primary purpose is to grind, lap and polish wafers, but it is also suitable for working on abrasive nanomaterials such as diamond, silicon carbide, and alumina. It can process wafers up to 75mm in diameter with precision and accuracy. To obtain the desired results, HT-301NB is equipped with a stationary, high-torque grinding spindle that can be set precisely. The machine's frame is constructed of a durable yet lightweight aluminum alloy that enables it to respond quickly to items set within tolerance parameters. The spindle is driven by an AC motor that provides the speed and power needed to achieve the desired results. The wafers are secured and accurately machined within the machine's frame work. This is accomplished through the combination of a precise "Centering Prongs" positioning system along with an optional "Wafer Clamp". Together, these features ensure the proper alignment, securement and even distribution of the polishing medium applied to the wafers. For lapping and polishing, NIHON MICRO COATING HT-301NB is outfitted with a sliding switch that allows for both wet and dry techniques. It also features a built-in wafer polishing unit that is designed to allow for precise and accurate handling of the wafers. Vacuum control is also available for accurate surface removal. HT-301NB also has an automated chip cleaning machine that minimizes downtime between grinding sessions. The cleaning station is fast and efficient, as it allows for removing slurry, chips, and other residues without needing to manually intervene. The cleaning tool is equipped with both air and vacuum forces for thorough and reliable results. In summary, NIHON MICRO COATING HT-301NB is a robust and robust, wafer grinding, lapping & polishing asset that is designed to provide accurate, precise, and repeatable results. It features a durable aluminum alloy construction, high torque grinding spindle, built-in wafer polishing model, automated chip cleaning station, and accurate Centering Prongs positioning equipment along with Wafer Clamps. This system is suitable for all types of nanomaterials, including diamond, silicon carbide, alumina, and more.