Used NIKKO NFG-515 #9093450 for sale

NIKKO NFG-515 is a wafer grinding, lapping & polishing equipment ideal for the conditioning of semiconductor wafers, crystals and other smooth surfaces. This semi-automated system is capable of single and batch grinding, lapping and polishing of substrates up to 5" in diameter, with a superior degree of accuracy and repeatability. The unit is equipped with a flatbed work stage that allows for precise positioning of the substrate to be processed on the platen, and is designed to accept standard 4-inch or 5-inch cassettes for the feeding and machine loading. The cassette loader can be operated manually or in automation mode, depending on the application requirements and the number of wafers to be processed. The grinding, lapping & polishing process is driven by two separate high-resolution stepper motor drives, providing superior repeatability and accuracy. The tool can be used to grind, lap and polish wafers using a variety of grinding media and polishing pads, depending on the desired material removal rate and surface finish. The asset can deliver a wide range of surface finishes and microstructures, including near atomically flat surfaces. The platen includes a variable speed drive with a range of up to 2000 RPM and a maximum force of 1000 N. This variable speed allows for accurate control of the material removal rate, while the precise micro-step control ensures superior accuracy and repeatability. The model is also equipped with a motion controller, which enables the precise programming of complex grinding, lapping and polishing processes. In addition to the grinding, lapping & polishing processes, NFG-515 equipment also includes a number of additional features and accessories, such as a vacuum chuck for vacuum-assisted processing, substrate holders for larger substrates, particle deposition system for precise particle deposition, and a pressure detection unit for precise force measurement. Overall, NIKKO NFG-515 is a compact, precise and versatile machine for the conditioning of semiconductor wafers, crystals and other smooth surfaces. This tool is ideal for demanding applications, such as planarization, CMP (chemical-mechanical polishing), and other surface processing tasks. The superior single and batch processing capabilities, combined with the variable speed drive, precise positioning and micro-step control, provides superior accuracy and repeatability, making the asset ideal for manual, semi-automated and automated processing.