Used NISSEI MF-15 #9032951 for sale

NISSEI MF-15 Wafer Grinding, Lapping and Polishing equipment has been designed to provide a fully automated, high productivity and high precision solution for fine grinding, lapping and polishing of precision wafers. It is a versatile, low cost machine with an impressive throughput capacity and robust design. The system is fully integrated with a unique micro & nano-mechanical features for highest precision mechanical processing and metrology operations. MF-15 features three main components: a high speed spindel motor (HSM), a lapping table and a polishing table. The HSM is connected to the lapping table and polishing table by a drive unit, allowing for a wide variety of motion profiles and finely tuned speed and acceleration. This allows the user to select and adjust the grinding speed to meet all normal and special requirements. The lapping table is equipped with a self-generating, vibratory oscillation machine that creates a circulatory movement to maximize the wafer surface area to be processed. This process reduces localized grinding marks, reduces the dwelling time of the wafer and significantly improves roughness. The polishing table allows for a controlled uniform grinding action, giving a smooth surface finish. NISSEI MF-15 offers outstanding operator safety with its safety door which can only be opened when the motor is stopped. It also has an emergency cut out tool which protects the user from damage from an unexpected overloading of the asset. The user interface of MF-15 is equipped with a touchscreen display, enabling operators to program it for specific job functions. Settings can be adjusted on the fly and can be monitored and adjusted without interruption, ensuring consistent results. NISSEI MF-15 is a top choice in the market for wafer grinding, lapping and polishing due to its user-friendliness, high versatility, safety features and high precision mechanical processing capabilities. It is suitable for wafer grinding applications such as pre-grinding, finishing, lapping and polishing of semiconductors, ceramic substrates and other related products.