Used NISSIN Hi-grind #9009445 for sale

NISSIN Hi-grind is a state-of-the-art wafer grinding, lapping and polishing equipment designed for the precision machining of wafers and other delicate substrates. This system offers a number of unique features that make it an ideal choice for applications in which precision and accuracy are of utmost importance. Hi-grind uses a proprietary grinding head which is designed to reduce material removal to less than 0.02 micron and maintain surface flatness below one tenth of a micron. This precision grinding head is connected to a high-speed motor, enabling its operation at speeds of up to 16,000 RPM for fast and consistent machining of wafers. NISSIN Hi-grind also features an Advanced Lapping & Polishing Unit (ALPS) for achieving ultra-fine finish. This machine utilizes ceramic abrasive particles and specialized controlled-vacuum technology to deliver an incredibly smooth surface finish. The resulting wafer will feature a surface roughness that is approximately one-seventh that of a conventionally-polished wafer. Hi-grind also has an optional Heated Stage for precise temperature control during grinding and polishing. This not only ensures optimal tool performance but also minimizes thermal damage to the wafer, thereby preserving the substrate's structural integrity. To further ensure maximum productivity and efficiency, NISSIN Hi-grind employs an intelligent control tool with a graphical user interface. This allows for an operator to easily monitor and adjust machine parameters such as the grinding speed, lapping speed, and stage temperature, among other settings. Hi-grind is designed to achieve high accuracy and precision, providing the perfect solution for wafer grinding, lapping and polishing applications. Its cutting-edge design and features make it a must-have piece of equipment for any microelectronics facility.