Used NORDSON G-12-I-DCT #9025072 for sale

NORDSON G-12-I-DCT
ID: 9025072
Diamond pellet grinder Single spindle Capacity: up to 12" Spindle drive: 1.5 HP motor with speed control and brake Spindle speeds: variable 300 to 1800 rpm Stroke length: 0 to 4" Stroke displacement: 0 to 5" off center Cycle time: 0 to 5 minutes standard Overarm pressure: 0 to 60 lbs Coolant pump: 1/8 HP Power requirements: 208/220 V, 1 phase, 12 A.
The NORDON NORDSON G-12-I-DCT is an advanced wafer grinding, lapping and polishing equipment designed for processing wafers of various materials in a wide variety of industries. It is well-suited for a range of applications including the preparation of wafers for advanced packaging techniques such as flip-chip, and the fabrication of MEMS and semiconductor devices. The system features an integrated grinding station which provides precision machining for different wafer materials, such as silicon, gallium nitride, and diamond or sapphire. It also offers both wet and dry grinding options, with a capability for continuous polishing of up to 12 wafers of varying sizes. The integrated lapping station is capable of polishing the entire wafer surface, while the precision symmetrical multi-point grinding head ensures quality and accuracy across the entire face of the wafer. The unit has automated lapping capabilities which enable the user to program independent, multi-point grinding heads with optimized and repeatable settings. It also features an automated loading machine which allows wafers to be loaded and unloaded without the need for manual intervention. G-12-I-DCT is equipped with an advanced auto-guard safety tool to ensure the safety of operators and the equipment. Additionally, it is designed with precise and reliable vacuum and air cooling systems which help maintain the quality of the wafers throughout the grinding and lapping process. In addition to the integrated grinding and lapping steps, the asset is also constructed with a comprehensive suite of process control tools and easy to use monitoring and feedback systems. This enables the user to program precise settings for the grinding and lapping process and to keep track of the progress. The NORDON NORDSON G-12-I-DCT is an advanced wafer grinding, lapping and polishing model designed to address the complex fabrication needs of today's semiconductor and MEMS industries. It's automated features, precision machining capacity, and comprehensive process control provide high-accuracy results with flexibility and repeatability.
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