Used NOVAPURE 200 #62125 for sale

NOVAPURE 200 is a multifunctional wafer grinding, lapping and polishing equipment designed to create ultrasmooth surfaces and flatness beyond 0.3 nm. The system allows for complex surface configurations as well as lap and polishing of intricate components. 200 unit is ideal for grinding hard and brittle materials, including wafers, substrates and ceramic materials such as quartz, alumina, piezo-ceramics, glass, semiconductor materials and more. The machine is comprised of a high-precision, pneumatic-driven spindle, with indexing features for higher accuracy grinding processes. Featuring an aluminium base for improved stability and vibration dampening, NOVAPURE 200 is highly durable and is fitted with an ergonomic user interface for easy operation. Furthermore, the tool is equipped with a controlled coolant-lubrication asset with up to 5 levels of cooling pressure. This allows for greater precision and reduced development time due to the improved cooling capability of the machine. NOVAPURE modular design allows for a wide range of platen sizes, materials and working parameters for improved grinding, lapping and polishing operations. For a superior polishing experience, 200 can be coupled with the RIE polishing head. This offers uniform precision and cleaning, with the polishing head's trays able to accommodate a range of components including wafers, substrates and molded parts. NOVAPURE 200 is an effective and efficient tool for precision grinding, lapping and polishing of materials. It brings technology and innovation to grinding operations, allowing for improved surface finish and flatness. With its all-in-one design, robotic control and modular parameters, the model is an all-encompassing solution for wafer grinding and polishing needs, perfect for those looking for higher levels of accuracy.