Used NOVAPURE EGS-237 #9204773 for sale

NOVAPURE EGS-237 is a wafer grinding, lapping & polishing equipment designed for precise critical processing of wafers on the nanometer scale. It combines the use of mechanical grinding and lapping processes in order to achieve high material removal rates and improve surface quality. It is suitable for applications in semiconductor manufacturing industries such as flatter, thinner, and faster devices. The integrated wafer processing system is capable of grinding, lapping, and polishing both single- and double-sided wafers with great precision. The unit features an ergonomic console with an intuitive touch screen, making it easier to program and operate the machine. This console is designed to minimize operator fatigue and improve efficiency. NOVAPURE EGS237 tool is designed to work with 2-inch, 4-inch, 6-inch, and 8-inch wafer sizes. A broad range of processable materials is available, such as gallium arsenide (GaAs), gallium nitride (GaN), germanium (Ge), and various silicons. To ensure repeatable and consistent results, EGS-237 features a closed-loop control asset with real-time process monitoring. This is combined with user-friendly software that makes it easy to set up and monitor each step of the wafer grinding, lapping, and polishing processes. The model also offers various safety features to prevent operator harm. This includes a safety chamber to contain any dust and debris that might become airborne during the grinding, lapping, and polishing process as well as an emergency stop function to halt the machine in case of emergency. Furthermore, EGS237 equipment is designed for improved productivity. It is capable of grinding, lapping, and polishing up to 15 wafers per hour. This is made possible by a simple exchange procedure which allows operators to quickly switch between wafer processing steps without having to set process parameters. Overall, NOVAPURE EGS-237 system is a highly efficient unit that offers great performance and user comfort in the area of wafer grinding, lapping, and polishing. It offers quick and reliable wafer processing at the nanometer scale, while ensuring consistent and repeatable results.