Used NOVELLUS / IPEC 776 #293741214 for sale
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NOVELLUS / IPEC 776 is a state-of-the-art wafer grinding, lapping, and polishing machine designed for both high production volume and precision applications. It was developed by IPEC Systems, the leading name in semiconductor equipment for over 50 years. IPEC 776 is suitable for a wide variety of applications, such as grinding wafers to various angles, lapping the wafers to achieve the requested flatness, and polishing the wafers to the requested specifications. NOVELLUS 776 has a multitude of features that make it an attractive option for high-volume and precision requirements. The machine is designed to store and recall up to 25 process recipes, suitable for grinding, lapping, and polishing. It also has a robust design with a variety of safety features, including an emergency stop, E-Stop safety mechanism, and a door safety interlock. 776 also features a 50-slot tool selection system, allowing operators to make quick changes to the wafer's active abrasives as needed. The machine also uses a variety of external chucks for optimal wafer clamping, and automated wafer cleaning capabilities as well. NOVELLUS / IPEC 776 also includes a range of advanced process monitoring and control systems. This includes a comprehensive data acquisition system, allowing operators to store data for future analysis. It also has an intelligent process control (IPC) system, which monitors and adjusts processes to ensure the most precise and reproducible results. It also includes IRC (intelligent rpm control) and GPC (grinding process control) systems, which help maintain consistency between consecutive passes of the wafer. IPEC 776 is an extremely versatile machine, enabling operators to process wafers of various sizes and a variety of compositions and coatings. This allows for flexible production and helps it achieve its high levels of throughput and accuracy. Finally, NOVELLUS 776 can be integrated with various other pieces of equipment, such as automated metrology systems, to create a complete unattended grinding, lapping, and polishing solution. Overall, 776 is an excellent choice for high-volume and precision wafer grinding, lapping, and polishing operations.
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